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ISTFA 2001 : International Symposium for Testing and Failure Analysis

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Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November 2001, Santa Clara, California.

This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis.

The CD-ROM provides the complete content of the book in searchable Adobe Acrobat PDF format.

Contents include: Advanced techniques Packaging Backside analysis Scanning probe microscopy Focused ion beam (FIB) techniques Failure analysis of micro-electromechanical systems (MEMS) Yield improvement Discretes Defect-based testing Case histories.

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Product Details
ASM International
0871707462 / 9780871707468
Mixed media product
01/12/2001
United States
550 pages
156 x 230 mm
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