Reliability for Logic & Memory Tech PAL Format

Technology scaling pushes existing ULSI materials and devices towards their intrinsic reliability limits.

Maintaining a high level of reliability without limiting continued scaling and circuit integration is a key challenge.

The convergence of several factors is making "the reliability challenge" a more critical issue.

Existing testing methodologies are no longer capable of resolving the reliability levels required by customers, necessitating new approaches to reliability assurance.

Increasing performance requirements for new generations of technology are either pushing existing materials to their limits, or are mandating the use of novel materials, whose reliability improvement is a fundamental limitations are not well understood.

The key to continued reliability improvement is a fundamental understanding of the mechanisms of failure, and the manufacturing and design factors that affect them.

This course, recorded at the December 1998 International Electronic Device Meeting, presents detailed discussions o the major reliability issues that face IC technology development and manufacturing as we move into the Giga-Scale Integration era.

Continued success requires that these issues be understood and considered by everyone, including proces, device and circuit engineers.