Search Results - Lau, John H. - Books

Heterogeneous Integrations

Hardback 12 Apr 2019
ISBN: 9789811372230
Dewey: 621.381
£103.99
RRP £129.99
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Chiplet Design and Heterogeneous Integration Packaging

Hardback 28 Mar 2023
ISBN: 9789811999161
Dewey: 621.3815
£119.99
RRP £149.99
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£111.99
RRP £139.99
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Assembly and Reliability of Lead-Free Solder Joints

Paperback / softback 30 May 2021
ISBN: 9789811539220
£79.99
RRP £99.99
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Reliability of RoHS-compliant 2D and 3D IC interconnects

eBook 1 Feb 2011
Publisher McGraw-Hill
ISBN: 9780071753807
Dewey: 621.381046
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£131.40
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Through-silicon vias for 3D integration

eBook 4 Aug 2012
Publisher McGraw-Hill
ISBN: 9780071785150
Dewey: 621.3815
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£145.80
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Solder Joint Reliability: Theory and Applications

Ebook 27 Nov 2013
Publisher Springer
ISBN: 9781461539100
Dewey: 671.52042
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£179.50
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Semiconductor Advanced Packaging

Ebook 17 May 2021
Publisher Springer Singapore
ISBN: 9789811613760
Licence From
£99.50
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Handbook Of Tape Automated Bonding

Hardback 31 Jan 1992
ISBN: 9780442004279
Dewey: 621.381046
£179.99
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Chip On Board : Technology for Multichip Modules

Hardback 30 Jun 1994
ISBN: 9780442014414
Dewey: 621.3815
£179.99
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Solder Joint Reliability : Theory and Applications

Paperback 1 Sep 2011
Publisher Springer
ISBN: 9781461539117
£24.99
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Fan-Out Wafer-Level Packaging

Paperback / softback 16 Dec 2018
ISBN: 9789811342660
Dewey: 620.11295
£89.99
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Advanced MEMS packaging

eBook 22 Oct 2009
Publisher McGraw-Hill
ISBN: 9780071627924
Dewey: 621.381046
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£161.10
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Mechanics of Solder Alloy Interconnects

Hardback 31 Jan 1994
ISBN: 9780442015053
Dewey: 671.56
£179.99
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Solder Joint Reliability : Theory and Applications

Hardback 31 May 1991
ISBN: 9780442002602
Dewey: 671.52042
£179.99
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The Handbook of Fine Pitch Surface Mount Technology

Hardback 1 Oct 1993
ISBN: 9780442012588
Dewey: 621.3815
£72.00
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Solder Joint Reliability : Theory and Applications

Paperback / softback 23 Feb 2014
ISBN: 9781461367437
Dewey: 671.52042
£179.99
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Fan-Out Wafer-Level Packaging

Ebook 5 Apr 2018
Publisher Springer Singapore
ISBN: 9789811088841
Licence From
£89.50
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Heterogeneous integrations

Ebook 3 Apr 2019
Publisher Springer
ISBN: 9789811372247
Dewey: 621.395
Licence From
£129.50
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Chiplet Design and Heterogeneous Integration Packaging

Ebook 27 Mar 2023
Publisher Springer
ISBN: 9789811999178
Dewey: 621.3815
Licence From
£149.50
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Hardback 8 Feb 2000
ISBN: 9780071351416
Dewey: 621.381
Out of Print

Thermal Stress and Strain in Microelectronics Packaging

Hardback 1 Aug 1993
ISBN: 9780442010584
Dewey: 621.381
Out of Print

Fan-Out Wafer-Level Packaging

Hardback 13 Apr 2018
ISBN: 9789811088834
Dewey: 620.11295
£98.99
RRP £109.99
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Chiplet Design and Heterogeneous Integration Packaging

Paperback / softback 29 Mar 2024
ISBN: 9789811999192
£87.99
RRP £109.99
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Semiconductor Advanced Packaging

Hardback 18 May 2021
ISBN: 9789811613753
Dewey: 621.381046
£116.99
RRP £129.99
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Semiconductor Advanced Packaging

Paperback / softback 19 May 2022
ISBN: 9789811613784
Dewey: 621.381046
£89.99
RRP £99.99
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£149.99
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Heterogeneous Integrations

Paperback 6 Apr 2019
Publisher Springer
ISBN: 9789811372254
Out of Print

Chiplet Design and Heterogeneous Integration Packaging

Paperback 28 Mar 2023
Publisher Springer
ISBN: 9789811999185
£35.99
RRP £39.99
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Assembly and Reliability of Lead-Free Solder Joints

Ebook 29 May 2020
Publisher Springer
ISBN: 9789811539206
Licence From
£99.50
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